英语翻译3.Previous Working Experience2002.10-2006.5Company:China Resource Micro-Assembly Tech.,Ltd?Company Property:Joint VentureCompany Size:2000 employees aroundCompany Products:QFP、SOP、HSOP、LQFP、DIP、SSOP、PLCCPosition:Equipment engi

英语翻译3.Previous Working Experience2002.10-2006.5Company:China Resource Micro-Assembly Tech.,Ltd?Company Property:Joint VentureCompany Size:2000 employees aroundCompany Products:QFP、SOP、HSOP、LQFP、DIP、SSOP、PLCCPosition:Equipment engi
英语翻译
3.Previous Working Experience
2002.10-2006.5
Company:China Resource Micro-Assembly Tech.,Ltd?
Company Property:Joint Venture
Company Size:2000 employees around
Company Products:QFP、SOP、HSOP、LQFP、DIP、SSOP、PLCC
Position:Equipment engineer( Singulation)
( GPM,ASM,YAMADA,TOWA,高柏斯,三佳)
Job Description as below:
The new material evaluation,In charge of spare part control.
Maintain,install,troubleshoot and repair of equipment tooling.
Assist in developing new device/package start-up.
Assist in equipment improvement/equipment upgrading plan.
Weekly,monthly,yearly,issue the engineering performance report to manager as soft copy.
2001.7-2002.2
Company:China resource microelectronic (Holdings) limited
Company Property:Joint Venture
Company Size:8000 employees around
Company Products:Transistor
Position:Technician (Die attached,Plating)
Job Description as below:
Maintain the machine daily.
Handle the tooling sourcing and management,issue PR to purchasing department.
Assist with process engineer to achieve the necessary yield.
4.Education
1998.9-2003.7,JSIT.
Jiangsu College of Information Technology.
Major in:Integrated Circuit Manufacturing Technology.
Main Subject as bellow:
Physics of Semiconductor Devices.
Ultra large scale (ULC) integrated circuit process.
Bonding technique of integrated circuit/discrete device.
Foundation of Circuit.
Thin/Thick Film Integrated Circuit Process.
Electronic Application Technology.
Analog integrated circuit.
C Language etc…
5.Certification
Certification Institution:China Information industry Ministry
Senior Engineer---Semiconductor chip manufacture.
Senior Engineer--- Senior Engineer--Semiconductor Assembly Process & Application.
Certification Institution:Gallant Micro Machining Corporation
Mold Manufacturing & Assembling Intern Diploma Certification.

英语翻译3.Previous Working Experience2002.10-2006.5Company:China Resource Micro-Assembly Tech.,Ltd?Company Property:Joint VentureCompany Size:2000 employees aroundCompany Products:QFP、SOP、HSOP、LQFP、DIP、SSOP、PLCCPosition:Equipment engi
3.以前的 工作经历
2002.10-2006.5
公司:China Resource Micro-Assembly Tech.,Ltd
公司性质:合资
公司规模:2000人左右
公司生产的产品:QFP、SOP、HSOP、LQFP、DIP、SSOP、PLCC
担任职位:装备工程师 (GPM,ASM,YAMADA,TOWA,高柏斯,三佳)
PS:那些产品的专有名词你自己该知道吧
工作描述:
新物料的评估,负责备件控制.
维护,安装,故障检修和维修装备模具.
协助开发新装置
协助改善装备/更新装备计划
每周,每月,每年向经理用软件拷贝的形式汇报工程执行报告
2001.7-2002.2
公司:
公司性质:合资
公司规模:8000人左右
公司产品:电子晶体管
职位:技术员
工作描述:
每天维护保养机器
处理模具来源和管理,发放PR 给采购部门
协助工程师达到必要的产量.