英语翻译Another issue with the entire circuit is the frequency dependence of the models.We used isolated experiments to try to understand these effects,but a complete analysis is lacking.This is complicated by the fact that the entire circuit doe

英语翻译Another issue with the entire circuit is the frequency dependence of the models.We used isolated experiments to try to understand these effects,but a complete analysis is lacking.This is complicated by the fact that the entire circuit doe
英语翻译
Another issue with the entire circuit is the frequency dependence of the models.We used isolated experiments to try to understand these effects,but a complete analysis is lacking.This is complicated by the fact that the entire circuit does not operate at 2.4 GHz.While these results did not affect the simulation of the TXA,which does operate at 2.4 GHz,when the IF portion is included the constant lumped element model parameter values may become less accurate.If this is true,a means of modeling the parasitic elements over a large frequency range is possible using algorithms for generating reduced order models directly from the quasistatic governing equations.
Adding lumped element RLC models for the package leads,bondwires,DA plane,and on-chip interconnect provided accurate simulation results for the transmit amplifier of the HFA3624.It shows the importance of modeling the entire packaged IC and the effectiveness of the 3-D field solver codes.In particular the multipoleaccelerated method-of-moments capacitance and inductance codes were utilized extensively and proved to be an accurate means for characterizing interconnect.
As a result of this work,Harris Semiconductor has established a comprehensive package and interconnect modeling strategy based on 3-D electromagnetic simulation for all RF product developments.As part of this strategy,the public domain codes FastCap and FastHenry from MIT have been completely integrated into the design flow to provide fully automated extraction of bondwire,die attach,and on-chip interconnect models from layout data.
认真点啊 用软件翻译最少也要通顺吧

英语翻译Another issue with the entire circuit is the frequency dependence of the models.We used isolated experiments to try to understand these effects,but a complete analysis is lacking.This is complicated by the fact that the entire circuit doe
Another issue with the entire circuit is the frequency dependence of the models. We used isolated experiments to try to understand these effects, but a complete analysis is lacking. This is complicated by the fact that the entire circuit does not operate at 2.4 GHz. While these results did not affect the simulation of the TXA, which does operate at 2.4 GHz, when the IF portion is included the constant lumped element model parameter values may become less accurate. If this is true, a means of modeling the parasitic elements over a large frequency range is possible using algorithms for generating reduced order models directly from the quasistatic governing equations.
模型的频率相依关系是整个电路的另一个课题.我们通过进行个别的实验来了解这些效应,但却没有完整的分析.整个问题变得复杂化是因为电路在2.4 GHz的频率无法工作.尽管这些结果对于不在2.4 GHz频率上运作的TXA的模拟没有影响,然而,当加入中频的部分后,恒定集总元件模型参数值的准确率可能会下降.如果确实这样,直接从准静态控制方程式中运用生成降阶模型的演算,来作为大频率范围的寄生元件的建模途径是可行的.

Adding lumped element RLC models for the package leads, bondwires, DA plane, and on-chip interconnect provided accurate simulation results for the transmit amplifier of the HFA3624. It shows the importance of modeling the entire packaged IC and the effectiveness of the 3-D field solver codes. In particular the multipole accelerated method-of-moments capacitance and inductance codes were utilized extensively and proved to be an accurate means for characterizing interconnect.
在封装引线、接合线、DA面及片内互连线中添加集总元件RLC模型可以为HFA3624发送放大器提供准确的模拟结果.它显示出对整体封装集成电路建模的重要性,以及3-D磁场解算码的有效性.特别是多极加速矩量法的电容与电感码的广泛使用,而且被证实这是记录互连特性的准确方法.
As a result of this work, Harris Semiconductor has established a comprehensive package and interconnect modeling strategy based on 3-D electromagnetic simulation for all RF product developments. As part of this strategy, the public domain codes FastCap and FastHenry from MIT have been completely integrated into the design flow to provide fully automated extraction of bondwire, die attach, and on-chip interconnect models from layout data.
由于这研究的结果,Harris半导体公司为其所有射频产品的研发,建立了一套基于3-D电磁模拟的综合封装与互连的建模策略.作为这策略的一部分,麻省理工学院的公共领域代码FastCap和FastHenry已被完全融入到设计的流程,以便能够从布置数据中全自动地抽取接合线、芯片粘贴及片内互连的模型.
【英语牛人团】