把这段摘要改成英文防焊作为PCB板成形前的最主要一道工序,它对于PCB板的最终质量起着决定性作用.本文叙述了防焊剂、多层印制电路板防焊工艺流程.重点分析探讨了液态绿漆制程能力以及

把这段摘要改成英文防焊作为PCB板成形前的最主要一道工序,它对于PCB板的最终质量起着决定性作用.本文叙述了防焊剂、多层印制电路板防焊工艺流程.重点分析探讨了液态绿漆制程能力以及
把这段摘要改成英文
防焊作为PCB板成形前的最主要一道工序,它对于PCB板的最终质量起着决定性作用.本文叙述了防焊剂、多层印制电路板防焊工艺流程.重点分析探讨了液态绿漆制程能力以及防焊中出现的不良缺陷,分析其原因,并探讨出改善对策.研究表明,要不断的探索既符合板子的性能要求又要满足在一定时间内满足产量的防焊剂；规范防焊工艺的步骤.从而更进一步地提高多层印制电路板的防焊技术.

把这段摘要改成英文防焊作为PCB板成形前的最主要一道工序,它对于PCB板的最终质量起着决定性作用.本文叙述了防焊剂、多层印制电路板防焊工艺流程.重点分析探讨了液态绿漆制程能力以及
Anti welding as PCB plate forming before the main procedure,it for PCB plate final quality plays a decisive role.This paper describes the solder resist,multilayer printed circuit board and welding process.Analyzes the liquid green paint process capability as well as the solder resist some harmful defects,analysis of its causes,and discusses the measures to improve.Research shows that,to constantly explore both with the board of the performance requirements and also meet in a certain period of time to meet the yield of soldering flux; solder process steps for.In order to further improve the multilayer printed circuit board technology.

The welding as PCB before forming the main procedure, it for PCB quality final decisive. This paper describes the flux, multi-layer printed circuit board the welding process. Key analyses and discusse...

全部展开

The welding as PCB before forming the main procedure, it for PCB quality final decisive. This paper describes the flux, multi-layer printed circuit board the welding process. Key analyses and discusses the liquid green paint process capability and the welding of the defects in bad, analyze the causes, and discusses the countermeasures to improve. Research shows that, to continuously explore not only conforms to the performance requirements of the board to meet again in a certain time and meet the production flux; Regulate the welding process of steps. To further improve the multi-layer printed circuit board and welding technology.

收起