英语翻译Voids in the encapsulant are a potential problem,these can originate during dispense,die placement,or reflow,but can be eliminated through proper materials selection,board preparation dispense parameters and reflow condition.
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英语翻译Voids in the encapsulant are a potential problem,these can originate during dispense,die placement,or reflow,but can be eliminated through proper materials selection,board preparation dispense parameters and reflow condition.
英语翻译
Voids in the encapsulant are a potential problem,these can originate during dispense,die placement,or reflow,but can be eliminated through proper materials selection,board preparation dispense parameters and reflow condition.
英语翻译Voids in the encapsulant are a potential problem,these can originate during dispense,die placement,or reflow,but can be eliminated through proper materials selection,board preparation dispense parameters and reflow condition.
密封剂里的空隙是一个潜在的问题,它们会在调剂、模具放置或回流期间产生,但也可以通过合适的材料选择、板制备免除参数和回流条件而消除.
在密封剂中空虚感是一潜在问题,这些能发源在期间特许,像放置或者退潮那样死去,但是是能通过恰当材料消灭选择,板准备配发参数和退潮状况.
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在密封剂的空隙是一个潜在的问题,这些可以发起期间、 模具放置或回流,但却可以被淘汰通过合适的材料选择板制备免除参数和回流条件。
在密封材料中空洞是个潜在的问题,这些都源于配剂,芯片贴装,或圆滑热处理的过程,但可以通过选择适当的材料,基板制备配剂参数和圆滑热处理的条件来排除。