PCB基本的原理和流程用英语怎么说

PCB基本的原理和流程用英语怎么说
PCB基本的原理和流程用英语怎么说

PCB基本的原理和流程用英语怎么说
PCB basic principles and processes
basic principles and processes of PCB

basic principle and flow of PCB(printed circuit board)
PCB基本原理和流程

* Process Module 说明 :

A. 下料 ( Cut Lamination)
a-1 裁板 ( Sheets Cutting)
a-2 原物料发料 (Panel)(Shear material to Size) B. 钻孔 (Drilling)
b-1 内钻 (I...

全部展开

* Process Module 说明 :

A. 下料 ( Cut Lamination)
a-1 裁板 ( Sheets Cutting)
a-2 原物料发料 (Panel)(Shear material to Size) B. 钻孔 (Drilling)
b-1 内钻 (Inner Layer Drilling )
b-2 一次孔(Outer Layer Drilling )
b-3 二次孔 (2nd Drilling)
b-4 雷射钻孔 (Laser Drilling )(Laser Ablation )
b-5 盲(埋)孔钻孔 (Blind & Buried Hole Drilling) C. 乾膜制程 ( Photo Process(D/F))

c-1 前处理 (Pretreatment)
c-2 压 膜 (Dry Film Lamination)
c-3 曝 光 (Exposure)
c-4 显 影 (Developing)
c-5 蚀铜 (Etching)
c-6 去膜 (Stripping)
c-7 初检 ( Touch-up)
c-8 化学前处理,化学研磨 ( Chemical Milling )
c-9 选择性浸金压膜 (Selective Gold Dry Film Lamination)
c-10 显 影(Developing )
c-11 去膜(Stripping )

D. 压 合 Lamination
d-1 黑 化 (Black Oxide Treatment)
d-2 微 蚀 (Microetching)
d-3 铆钉组合 (eyelet )
d-4 叠板 (Lay up)
d-5 压 合 (Lamination)
d-6 后处理 (Post Treatment)
d-7 黑氧化 ( Black Oxide Removal )
d-8 铣靶 (spot face)
d-9 去溢胶 (resin flush removal)
E. 减铜 (Copper Reduction)
e-1 薄化铜(Copper Reduction)

F. 电镀 (Horizontal Electrolytic Plating)
f-1 水平电镀 (Horizontal Electro-Plating) (Panel Plating)
f-2 锡铅电镀 ( Tin-Lead Plating ) (Pattern Plating)
f-3 低於 1 mil ( Less than 1 mil Thickness )
f-4 高於 1 mil ( More than 1 mil Thickness)
f-5 砂带研磨 (Belt Sanding)
f-6 剥锡铅 ( Tin-Lead Stripping)
f-7 微切片 ( Microsection)

G. 塞孔 (Plug Hole)
g-1 印刷 ( Ink Print )
g-2 预烤 (Precure)
g-3 表面刷磨 (Scrub)
g-4 后烘烤 (Postcure)

H. 防焊(绿漆): (Solder Mask)
h-1 C面印刷 (Printing Top Side)
h-2 S面印刷 (Printing Bottom Side)
h-3 静电喷涂 (Spray Coating)
h-4 前处理 (Pretreatment)
h-5 预烤 (Precure)
h-6 曝光 (Exposure)
h-7 显影 (Develop)
h-8 后烘烤 (Postcure)
h-9 UV烘烤 (UV Cure)
h-10 文字印刷 ( Printing of Legend )
h-11 喷砂 ( Pumice)(Wet Blasting)
h-12 印可剥离防焊 (Peelable Solder Mask)

I . 镀金 Gold plating
i-1 金手指镀镍金 ( Gold Finger )
i-2 电镀软金 (Soft Ni/Au Plating)
i-3 浸镍金 ( Immersion Ni/Au) (Electroless Ni/Au)
J. 喷锡 (Hot Air Solder Leveling)
j-1 水平喷锡 (Horizontal Hot Air Solder Leveling)
j-2 垂直喷锡 ( Vertical Hot Air Solder Leveling)
j-3 超级焊锡 (Super Solder )
j-4. 印焊锡突点 (Solder Bump)

K. 成型 (Profile)(Form)

k-1 捞型 (N/C Routing ) (Milling)
k-2 模具冲 (Punch)
k-3 板面清洗烘烤 (Cleaning & Backing)
k-4 V型槽 ( V-Cut)(V-Scoring)
k-5 金手指斜边 ( Beveling of G/F)

L. 短断路测试 (Electrical Testing) (Continuity & Insulation Testing)
l-1 AOI 光学检查 ( AOI Inspection)
l-2 VRS 目检 (Verified & Repaired)
l-3 泛用型治具测试 (Universal Tester)
l-4 专用治具测试 (Dedicated Tester)
l-5 飞针测试 (Flying Probe)

M. 终检 ( Final Visual Inspection)
m-1 压板翘 ( Warpage Remove)
m-2 X-OUT 印刷 (X-Out Marking)
m-3 包装 及出货 (Packing & shipping)

收起